Dynaflow melts and flows at temperatures very close to Stay Silv 15, and provides comparable brazed mechanical properties. This makes Dynaflow an excellent cost effective alternative to the 15% silver alloys. This premium, medium range silver alloy has been meticulously formulated to even tighter specifications than our standard copper-to-copper alloys

• Dynaflow is self fluxing on copper but requires use of Stay-Silv® white or black brazing flux when joining brass
• Dynaflow mirrors the brazing characteristics of Stay-Silv 15
• The melting range is wide enough to alloy filling gaps, necessary to braze loose connections or cap a finished joint
• When heated to its liquidus temperature the filler metal flows quickly to fill tight gaps or standard connections
• Specific gravity: 8.94, electrical conductivity: 8.80 (%IACS), electrical resistivity: 19.7, fluidity rating: 3, recommended joint clearance: 0.003/0.006 Inch, tensile strength: 35000 psi, 25% elongation in 2 Inch, boiling point: 4703 deg F

Harris® Dynaflow® D620F Silver Solder, Length: 20 Inch, Width: 1/8 Inch, Thickness: 0.05 Inch, Package: 25 lb, Form: Solid, Melting Range: 1981 deg F, Temperature: 1190 deg F (Solidus), 1465 deg F (Liquidus), 1300 - 1500 deg F (Brazing Range), Chemical Composition: 87.9% Copper (Cu), 6.1% Phosphorus (P), 6% Silver (Ag)